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 W681360
3V SINGLE-CHANNEL 13-BIT LINEAR VOICE-BAND CODEC
Data Sheet
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Publication Release Date: September 2005 Revision A.2
W681360
1. GENERAL DESCRIPTION
The W681360 is a general-purpose single channel 13-bit linear PCM CODEC with 2s complement data format. It operates from a single +3V power supply and is available in 20-pin SOG(SOP), SSOP and TSSOP package options. The primary function of the device is the digitization and reconstruction of voice signals, including the band limiting and smoothing required for PCM systems. The W681360 performance is specified over the industrial temperature range of -40C to +85C. The W681360 includes an on-chip precision voltage reference. The analog section is fully differential, reducing noise and improving the power supply rejection ratio. The VAG reference pin allows for decoupling of the internal circuitry that generates the reference voltage to the VSS power supply ground, minimizing clock noise on the analog circuitry when external analog signals are referenced to VSS. The data transfer protocol supports both long-frame and short-frame, synchronous and asynchronous communications for PCM applications. The W681360 accepts eight master clock rates between 256kHz and 4.800MHz, and an on-chip pre-scaler automatically determines the division ratio for the required internal clock. An additional on-chip power amplifier is capable of driving 300 loads differentially up to a level of 3.544V peak-to-peak. For fast evaluation a development kit (W681360DK) is available. For fast prototyping purposes a low-cost evaluation board (W681360ES) is also available. Applications * VoIP, Voice over Networks equipment * Digital telephone and communication systems * Wireless Voice devices * DECT/Digital Cordless phones * Broadband Access Equipment * Bluetooth Headsets * Fiber-to-curb equipment * Enterprise phones * Digital Voice Recorders
2. FEATURES
* * * * * * * * * * * * Single +3V power supply (2.7V to 5.25V) Typical power dissipation: 9.8mW Standby power dissipation: 3W Power-Down dissipation: 0.09W Fully-differential analog circuit design for low noise 13-bit linear A/D & D/A conversions with 2s complement data format CODEC A/D and D/A filtering compliant with ITU G.712 Eight master clock rates of 256kHz to 4.800 MHz 256KHz - 4.8MHz bit clock rates on the serial PCM port On-chip precision reference of 0.886 V for a -5 dBm TLP at 600 (436mVRMS) Programmable receive gain: 0 to -21dB in 3dB steps Industrial temp. range (-40C to +85C) 20-pin SOG (SOP), SSOP and TSSOP as well as a QFN-32L package Pb-Free / RoHS package options available
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Publication Release Date: September 2005 Revision A2
W681360
3. BLOCK DIAGRAM
Transmit Receive PCM PCM Interface Interface
BCLKR FSR PCMR BCLKT FST PCMT
PAO+ PAOPAI
G.712 CODEC
ROAO AI+ AIHB
256 kHz MCLK
256 kHz 512 kHz 1536 kHz 1544 kHz 2048 kHz 2560 kHz 4096 kHz 4800 kHz
Voltage reference
VAG VAGREF
Pre-scaler
8 kHz
Power Conditioning
VDD PUI VSS
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Publication Release Date: September 2005 Revision A.2
W681360
4. TABLE OF CONTENTS
1. GENERAL DESCRIPTION.................................................................................................................. 2 2. FEATURES ......................................................................................................................................... 2 3. BLOCK DIAGRAM............................................................................................................................... 3 4. TABLE OF CONTENTS ...................................................................................................................... 4 5. PIN CONFIGURATION ....................................................................................................................... 6 6. PIN DESCRIPTION ............................................................................................................................. 7 7. FUNCTIONAL DESCRIPTION............................................................................................................ 8 7.1. Transmit Path................................................................................................................................ 8 7.1.1 Input Operational Amplifier Gain ............................................................................................. 9 7.2. Receive Path............................................................................................................................... 10 7.2.1. Receive Gain Adjust Mode................................................................................................... 11 7.3. Power Management.................................................................................................................... 11 7.3.1. Analog and Digital Supply .................................................................................................... 11 7.3.2. Analog Ground Reference Bypass ...................................................................................... 11 7.3.3. Analog Ground Reference Voltage Output .......................................................................... 11 7.4. PCM Interface ............................................................................................................................. 12 7.4.1. Long Frame Sync................................................................................................................. 12 7.4.2. Short Frame Sync ................................................................................................................ 12 7.4.3. Special 16-bit Receive Modes.............................................................................................. 13 7.4.3.1. Sign-Extended Mode Timing............................................................................................. 13 7.4.3.2. Receive Gain Adjust Mode Timing.................................................................................... 13 7.4.4. System Timing ..................................................................................................................... 14 7.5. On-Chip Power Amplifier ............................................................................................................ 14 8. TIMING DIAGRAMS.......................................................................................................................... 15 9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20 9.1. Absolute Maximum Ratings ........................................................................................................ 20 9.2. Operating Conditions .................................................................................................................. 20 10. ELECTRICAL CHARACTERISTICS ............................................................................................... 21 10.1. General Parameters ................................................................................................................. 21 10.2. Analog Signal Level and Gain Parameters............................................................................... 22 10.3. Analog Distortion and Noise Parameters ................................................................................. 23 10.4. Analog Input and Output Amplifier Parameters ........................................................................ 24 10.5. Digital I/O .................................................................................................................................. 26 10.5.1. PCM Codes for Zero and Full Scale .................................................................................. 26 10.5.2. PCM Codes for 1kHz Digital Milliwatt ................................................................................ 26 11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27 12. PACKAGE DRAWING AND DIMENSIONS .................................................................................... 28 12.1. 20L SOG (SOP)-300mil ............................................................................................................ 28 12.2. 20L SSOP-209 mil .................................................................................................................... 29 12.3. 20L TSSOP - 4.4X6.5mm ......................................................................................................... 30 12.3. QFN-32L ................................................................................................................................... 31
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W681360
13. ORDERING INFORMATION........................................................................................................... 32 14. VERSION HISTORY ....................................................................................................................... 33
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W681360
5. PIN CONFIGURATION
VREF ROPAI PAOPAO+ VDD FSR PCMR BCLKR PUI
1 2 3 4 5 6 7 8 9 10
20 19 18 17
W681360 SINGLE CHANNEL CODEC
16 15 14 13 12 11
VAG AI+ AIAO HB VSS FST PCMT BCLKT MCLK
SOG, SSOP,TSSOP
VREF
VAG
NC
32 31 RO- 1 PAI PAO2 3
NC
30 29 28 27 26 25 NC 24 AI23 AO 22 HB 21 NC 20 VSS 19 FST 18 NC 17 PCMT
NC 4 PAO+ 5 VDD FSR 6 7
PCMR 8 BCLKR 9 10 NC 11 12 PUI NC 13 14 MCLK NC 15 16 BCLKT NC
QFN-32L
NC
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Publication Release Date: September 2005 Revision A.2
AI+
NC
W681360
6. PIN DESCRIPTION
Pin Name VREF Pin No.
nonQFN QFN
Functionality This pin is used to bypass the on-chip VDD/2 voltage reference for the VAG output pin. This pin should be bypassed to VSS with a 0.1F ceramic capacitor using short, low inductance traces. The VREF pin is only used for generating the reference voltage for the VAG pin. Nothing is to be connected to this pin except the bypass capacitor. Inverting output of the receive smoothing filter. This pin can typically drive a 2k load to 0.886VPEAK referenced to analog ground. Inverting input to the power amplifier. The non-inverting input is tied internally to VAG voltage. Inverting power amplifier output. The PAO- and PAO+ can drive a 300 load differentially to 1.772VPEAK. Non-inverting power amplifier output. The PAO- and PAO+ can drive a 300 load differentially to 1.772VPEAK. Power supply. Should be decoupled to VSS with a 0.1F ceramic capacitor. 8kHz Frame Sync input for the PCM receive section. FSR can be asynchronous to FST in either Long Frame Sync or Short Frame Sync mode. PCM input data receive pin. The data needs to be synchronous with the FSR and BCLKR pins. PCM receive bit clock input pin. Can accept any bit clock frequency from 256 to 4800kHz. When not clocked it can be used to select the 16 sign-bit extended synchronous mode (BCLKR=0) or the receive gain adjust synchronous mode (BCLKR=1) Power up input signal. When this pin is tied to VDD, the part is powered up. When tied to VSS, the part is powered down. System master clock input. Possible input frequencies are 256kHz, 512kHz, 1536kHz, 1544kHz, 2048kHz, 2560kHz, 4096kHz & 4800kHz. For performance reasons, it is recommended that MCLK be synchronous and aligned to the FST signal. This is a requirement in the case of 256 and 512kHz frequencies. PCM transmit bit clock input pin. Can accept any bit clock frequency from 256 to 4800kHz. PCM output data transmit pin. The output data is synchronous with the FST and BCLKT pins. 8kHz transmit frame sync input. This pin synchronizes the transmit data bytes. This is the supply ground. This pin should be connected to 0V. High-pass Bypass. Determines if the transmit high-pass filter is used (HB='0') or bypassed (HB='1'). When the high pass is bypassed the frequency response extends to DC. Analog output of the first gain stage in the transmit path. Inverting input of the first gain stage in the transmit path. Non-inverting input of the first gain stage in the transmit path. Mid-Supply analog ground pin, which supplies a VDD/2 volt reference voltage for allanalog signal processing. This pin should be decoupled to VSS with a 0.01F capacitor. This pin becomes high impedance when the chip is powered down.
1
30
ROPAI PAOPAO+ VDD FSR PCMR BCLKR PUI MCLK
2 3 4 5 6 7 8 9 10 11
1 2 3 5 6 7 8 9 12 13
BCLKT PCMT FST VSS HB AO AIAI+ VAG
12 13 14 15 16 17 18 19 20
16 17 19 20 22 23 24 26 29
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Publication Release Date: September 2005 Revision A.2
W681360
7. FUNCTIONAL DESCRIPTION
W681360 is a single-rail, single channel PCM CODEC for voiceband applications. The CODEC complies with the specifications of the ITU-T G.712 recommendation. The CODEC block diagram in Section 3 illustrates the main components of the W681360. The chip consists of a PCM interface, which can process long and short frame sync formats. The pre-scaler of the chip provides the internal clock signals and synchronizes the CODEC sample rate with the external frame sync frequency. The power conditioning block provides the internal power supply for the digital and the analog section, while the voltage reference block provides a precision analog ground voltage for the analog signal processing. The calibration level for both the Analog to Digital Converter (ADC) and the Digital to Analog Converter (DAC) is referenced to -Law with the same bit voltage weighing about the zero crossing, resulting in the 0dBm0 calibration level 3.2dB below the peak sinusoidal level before clipping, Based on the reference voltage of 0.886V the calibration level is 0.436 Vrms or -5dBm at 600.
VAG
+ -
+
PAO+ PAOPAI
13 DATA Receive
13 bit linear DAC
fC = 3400 Hz Smoothing Filter a High Pass Bypass
Buffer1 Av=1 Smoothing Filter b
RO-
AO AIAI+
13 DATA Transmit
13 bit linear ADC
fC = 200 Hz High Pass Filter
fC = 3400 Hz Anti-Aliasing Filter a
+ Anti-Aliasing Filter b
FIGURE 7.1: THE W681360 SIGNAL PATH
7.1. Transmit Path
The first stage of the A-to-D path of the CODEC is an analog input operational amplifier with externally configurable gain settings. A differential analog input may be applied to the Inputs AI+ and AI-. Alternately the input amplifier may be powered down and a single-ended input signal can be applied to either the AO pin or the AIpin. The input amplifier can be powered down by connecting the AI+ pin to either VDD or VSS which also determines whether AO or AI+ is selected as input according to
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W681360
Table 7.1. When the input operational amplifier is powered down the AO pin becomes high input impedance. TABLE 7.1: INPUT AMPLIFIER MODES OF OPERATION AI+ (Pin 19) VDD 1.2 to VDD-1.2 VSS Input Amplifier Powered Down Powered Up Powered Down Input AO (Pin 17) AI+, AI- (Pins 19, 18) AI- (Pin 18)
When the input amplifier is powered down, the input signal at AO or AI- should be referenced to the analog ground voltage VAG. The output of the input operational amplifier is first fed through a low-pass filter to prevent aliasing at the switched capacitor 3.4kHz low pass filter. Subsequently the 3.4kHz switched capacitor low pass filter bandlimits the input signals well below 4kHz. Signals above 4kHz would be aliased at the sampling rate of 8kHz. A high pass filter with a 200Hz cut-off frequency prevents DC coupling. All filters are designed according to the G.712 ITU-T specification. The high-pass filter may be bypassed depending on the logic level on the HB pin. If the high pass is removed the frequency response of the device extends down to DC. After filtering the signal is digitized as a 13-bit linear PCM code and fed to the PCM interface for serial transmission at the sample rate supplied by the external frame sync FST.
7.1.1 Input Operational Amplifier Gain The gain of the input operational amplifier can be adjusted using external resistors. For single-ended input operation the gain is given by a simple resistive ratio.
FIGURE 7.2: INPUT OPERATIONAL AMPLIFIER GAIN - SINGLE-ENDED INPUT
Ro AO AI+ AI+ Ri Vin VAG
Gin = Ro/Ri
For differential input operation the external resistor network is more complex but the gain is expressed in the same way. Of course, a differential input also has an inherent 6dB advantage over a corresponding single-ended input.
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W681360
Ro AO AI+ AI+ Ri Ri
VinVin+
Gin = Ro/Ri
Ro
VAG
FIGURE 7.3: INPUT OPERATIONAL AMPLIFIER GAIN - DIFFERENTIAL INPUT The gain of the operational amplifier will be typically be set to 30dB for microphone interface circuits. However the gain may be used for more than 30dB but this will require a compact layout with minimal trace lengths and good isolation from noise sources. It is also recommended that the layout be as symmetrical as possible as imbalances work against the noise canceling advantages of the differential design.
7.2. Receive Path
The 13-bit digital input samples for the D-to-A path are serially shifted in by the PCM interface and converted to parallel data bits. During every cycle of the frame sync FSR, the parallel data bits are fed through the 13-bit linear DAC and converted to analog samples. The analog samples are filtered by a low-pass smoothing filter with a 3.4kHz cut-off frequency, according to the ITU-T G.712 specification. A sin(x)/x compensation is integrated with the low pass smoothing filter. The output of this filter is buffered to provide the receive output signal RO-. The output may be also be attenuated when the device is in the receive path adjust mode. If the device is operated half-channel with the FST pin clocking and FSR pin held LOW, the receive filter input will be connected to the VAG voltage. This minimizes transients at the RO- pin when full-channel operation is resumed by clocking the FSR pin. The RO- output can be externally connected to the PAI pin to provide a differential output with high driving capability at the PAO+ and PAO- pins. By using external resistors various gain settings of this output amplifier can be achieved. If the transmit power amplifier is not in use, it can be powered down by connecting PAI to VDD. The bias voltage and signal reference of the PAO+ & PAO- outputs is the VAG pin. The VAG pin cannot source or sink as much current as these pins, and therefore low impedance loads must be placed between PAO+ and PAO-. The PAO+ and PAO- differential drivers are also capable of driving a 100 resistive load or a 100nF piezoelectric transducer in series with a 20 resister with a small increase in distortion. These drivers may be used to drive resistive loads of 32 when the gain of PAO- is set to 1/4 or less.
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W681360
7.2.1. Receive Gain Adjust Mode The W681360 can be put in the receive path adjust mode by applying a logic "1" to the BCLKR pin while all other clocks are clocked normally. The device is then in a position to read 16-bits of data, with three additional coefficient bits an addend to the 13-bit digital voice data. These three coefficients are used to program a receive path attenuation, thereby allowing the receive signal to be attenuated according to the values in the following table. If the feature is not used the default value is 0dB. TABLE 7.2: ATTENUATION COEFFICIENT RELATIONSHIP IN RECEIVE GAIN ADJUST MODE Coefficient 000 001 010 011 100 101 110 111 Attenuation (dB) 0 3 6 9 12 15 18 21
7.3. POWER MANAGEMENT
7.3.1. Analog and Digital Supply The power supply for the analog and digital parts of the W681360 must be 2.7V to 5.25V. This supply voltage is connected to the VDD pin. The VDD pin needs to be decoupled to ground through a 0.1 F ceramic capacitor.
7.3.2. Analog Ground Reference Bypass The system has an internal precision voltage reference which generates the VDD/2 mid-supply analog ground voltage. This voltage needs to be decoupled to VSS at the VREF pin through a 0.1 F ceramic capacitor.
7.3.3. Analog Ground Reference Voltage Output The analog ground reference voltage is available for external reference at the VAG pin. This voltage needs to be decoupled to VSS through a 0.01 F ceramic capacitor. The analog ground reference voltage is generated from the voltage on the VREF pin and is also used for the internal signal processing.
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W681360
7.4. PCM INTERFACE
The PCM interface is controlled by pins BCLKR, FSR, BCLKT & FST. The input data is received through the PCMR pin and the output data is transmitted through the PCMT pin. The Long Frame Sync or Short Frame Sync interface mode can be selected by connecting the BCLKR or BCLKT pin to a 256kHz to 4.800 MHz clock and connecting the FSR or FST pin to the 8kHz frame sync. The device synchronizes the data word for the PCM interface and the CODEC sample rate on the positive edge of the Frame Sync signal. Long Frame Sync is recognized when the FST pin is held HIGH for two consecutive falling edges of the bit-clock at the BCLKT pin. Short Frame Sync Mode is recognized when the Frame Sync signal at pin FST is HIGH for one and only one falling edge of the bit-clock at the BCLKT pin.
7.4.1. Long Frame Sync The device recognizes a Long Frame Sync when the FST pin is held HIGH for two consecutive falling edges of the bit-clock at the BCLKT pin. The length of the Frame Sync pulse can vary from frame to frame, as long as the positive frame sync edge occurs every 125 sec. During data transmission in the Long Frame Sync mode, the transmit data pin PCMT will become low impedance when the Frame Sync signal FST is HIGH or when the 13-bit data word is being transmitted. The transmit data pin PCMT will become high impedance when the Frame Sync signal FST becomes LOW while the data is transmitted or when half of the LSB is transmitted. The internal decision logic will determine whether the next frame sync is a long or a short frame sync, based on the previous frame sync pulse. To avoid bus collisions, the PCMT pin will be high impedance for two frame sync cycles after every power down state. Long Frame Sync mode is illustrated below. More detailed timing information can be found in the interface timing section.
BCLKT (BCLKR) FST (FSR) PCMT PCMR don't care 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 13 12 13 don't care
Long Frame Sync (Transmit and Receive Have Individual Clocking)
FIGURE 7.4: LONG FRAME SYNC PCM MODE
7.4.2. Short Frame Sync The W681360 operates in the Short Frame Sync Mode when the Frame Sync signal at pin FST is HIGH for one and only one falling edge of the bit-clock at the BCLKT pin. On the following rising edge of the bit-clock, the W681360 starts clocking out the data on the PCMT pin, which will also change from high to low impedance state. The data transmit pin PCMT will go back to the high impedance state halfway through the LSB. The Short Frame Sync operation of the W681360 is based on a 13-bit data word. When receiving data on the PCMR pin, the data is clocked in on the first falling edge after the falling edge that coincides with the Frame Sync signal. The internal decision logic will determine whether the next frame sync is a long or a short frame sync, based on the previous frame sync pulse. To avoid bus collisions, the PCMT pin will be high impedance for two frame sync cycles after every power down state. Short Frame Sync mode is illustrated below. More detailed timing information can be found in the interface timing section.
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W681360
BCLKT (BCLKR) FST (FSR) PCMT PCMR don't care 1 1 2 2 3 3 4 4 5 5 6 6 7 7 8 8 9 9 10 10 11 11 12 13 12 13 don't care
Short Frame Sync (Transmit and Receive Have Individual Clocking)
FIGURE 7.5: SHORT FRAME SYNC PCM MODE
7.4.3. Special 16-bit Receive Modes 7.4.3.1. Sign-Extended Mode Timing The Sign-bit extended mode is entered by applying a logic "0" to the BCLKR pin while all other clocks are clocked normally. In standard 13-bit mode the first bit is the sign bit. In this mode the device transmits and receives 16-bit data where the sign bit is extended to the first four data bits. The PCM timing for this mode is illustrated below.
BCLKT (BCLKR)
FST (FSR) SHORT OR LONG FRAME SYNC
PCMT PCMR don't care
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
12 13 12 13
14 14
15 16 15 16 don't care don't care
Sign-Extended (BCLKR=0) Transmit and Receive both use BCLKT, and the first four data bits are the sign bit. FST may occur at a different time than FSR
FIGURE 7.6: SIGN EXTENDED MODE
7.4.3.2. Receive Gain Adjust Mode Timing The Receive Path Adjust Mode is entered by applying a logic "1" to the BCLKR pin while all other clocks are clocked normally. In this mode the device receives 16-bit data where the last three bits are coefficients to program the Receive Gain Adjust Attenuation described above. The PCM timing for this mode is illustrated below.
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W681360
BCLKT (BCLKR)
FST (FSR) SHORT O R LONG FRAM E SYNC
PCMT PCMR don't care
1 1
2 2
3 3
4 4
5 5
6 6
7 7
8 8
9 9
10 10
11 11
12 13 12 13 14 15 16 don't care don't care
Receive Gain Adjust (BCLKR=1) Transm it and Receive both use BCLKT. FST m ay occur at a different tim e than FSR. Bits 14, 15, and 16, clocked into PCMR, are used for attenuation control for the receive analog output.
FIGURE 7.7: RECEIVE GAIN ADJUST TIMING MODE 7.4.4. System Timing The system can work at 256kHz, 512kHz, 1536kHz, 1544kHz, 2048kHz, 2560kHz, 4096kHz & 4800kHz master clock rates. The system clock is supplied through the master clock input MCLK and can be derived from the bit-clock if desired. An internal pre-scaler is used to generate a fixed 256kHz and 8kHz sample clock for the internal CODEC. The pre-scaler measures the master clock frequency versus the Frame Sync frequency and sets the division ratio accordingly. If both Frame Syncs are LOW for the entire frame sync period while the MCLK and BCLK pin clock signals are still present, the W681360 will enter the low power standby mode. Another way to power down is to set the PUI pin to LOW. When the system needs to be powered up again, the PUI pin needs to be set to HIGH and the transmit Frame Sync pulse needs to be present. It will take two transmit Frame Sync cycles before the pin PCMT becomes low impedance.
7.5. ON-CHIP POWER AMPLIFIER
The on-chip power amplifier is typically used to drive an external loudspeaker. The inverting input to the power amplifier is available at pin PAI. The non-inverting input is tied internally to VAG. The inverting output PAO- is used to provide a feedback signal to the PAI pin to set the gain of the power amplifier outputs (PAO+ and PAO-). These push-pull outputs are capable of driving a 300 load to 1.772 VPEAK. Connecting PAI to VDD will power down the power driver amplifiers and the PAO+ and PAO- outputs will be high impedance.
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W681360
8. TIMING DIAGRAMS
TFTRHM MCLK TMCKH TMCKL TBCK TFTRSM TMCK TRISE TFALL
BCLKT TFTRS TFTRH TFTFH TFS TFSL FST TFDTD PCMT MSB BCLKR (BCLKT) TBCK LSB TFDTD TBDTD THID THID TBCKH TBCKL
TFRRS TFRRH
TFRFH
TBCKH
TBCKL
FSR TDRS PCMR MSB TDRH LSB
FIGURE 8.1: LONG FRAME SYNC PCM TIMING NOTE: The Data is clocked out on the rising edge of BCLK. The Data is clocked in on the falling edge of BCLK.
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TABLE 8.1: LONG FRAME SYNC PCM TIMING PARAMETERS SYMBOL 1/TFS TFSL 1/TBCK TBCKH TBCKL TFTRH TFTRS TFTFH TFDTD TBDTD THID DESCRIPTION FST, FSR Frequency FST / FSR Minimum LOW Width 1 BCLKT, BCLKR Frequency 1 BCLKT, BCLKR HIGH Pulse Width BCLKT, BCLKR LOW Pulse Width BCLKT Falling Edge to FST Rising Edge Hold Time FST Rising Edge to BCLKT Falling edge Setup Time BCLKT Falling Edge to FST Falling Edge Hold Time The later of BCLKT rising edge, or FST rising edge to first valid PCMT Bit Delay Time BCLKT Rising Edge to Valid PCMT Delay Time Delay Time from the Later of FST Falling Edge, or BCLKT Falling Edge of last PCMT Bit to PCMT Output High Impedance BCLKR Falling Edge to FSR Rising Edge Hold Time FSR Rising Edge to BCLKR Falling edge Setup Time BCLKR Falling Edge to FSR Falling Edge Hold Time Valid PCMR to BCLKR Falling Edge Setup Time PCMR Hold Time from BCLKR Falling Edge MIN --TBCK 256 50 50 20 80 50 ----10 TYP 8 ------------------MAX --4800 ----------60 60 60 UNIT kHz sec kHz ns ns ns ns ns ns ns ns
TFRRH TFRRS TFRFH TDRS TDRH
20 80 50 1 50
-----------
-----------
ns ns ns ns ns
1
TFSL must be at least TBCK
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TFTRHM MCLK
TFTRSM
TMCK
TRISE
TFALL
TMCKH
TMCKL
TBCK
BCLKT
TFTRS TFTRH
TBCKH TFTFS TFTFH TFS
TBCKL
FST TBDTD PCMT MSB BCLKR (BCLKT) TBCK LSB TBDTD THID
TFRRS TFRRH
TFRFH FSR
TFRFS
TBCKH
TBCKL
TDRS PCMR MSB TDRH LSB
FIGURE 8.2: SHORT FRAME SYNC PCM TIMING
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TABLE 8.2: SHORT FRAME SYNC PCM TIMING PARAMETERS SYMBOL 1/TFS 1/TBCK TBCKH TBCKL TFTRH TFTRS TFTFH TFTFS TBDTD THID TFRRH TFRRS TFRFH TFRFS TDRS TDRH DESCRIPTION FST, FSR Frequency BCLKT, BCLKR Frequency BCLKT, BCLKR HIGH Pulse Width BCLKT, BCLKR LOW Pulse Width BCLKT Falling Edge to FST Rising Edge Hold Time FST Rising Edge to BCLKT Falling edge Setup Time BCLKT Falling Edge to FST Falling Edge Hold Time FST Falling Edge to BCLKT Falling Edge Setup Time BCLKT Rising Edge to Valid PCMT Delay Time Delay Time from BCLKT Falling Edge at last PCMT bit (LSB) to PCMT Output High Impedance BCLKR Falling Edge to FSR Rising Edge Hold Time FSR Rising Edge to BCLKR Falling edge Setup Time BCLKR Falling Edge to FSR Falling Edge Hold Time FSR Falling Edge to BCLKR Falling Edge Setup Time Valid PCMR to BCLKR Falling Edge Setup Time PCMR Hold Time from BCLKR Falling Edge MIN --256 50 50 20 80 50 50 10 10 20 80 50 50 1 50 TYP 8 ------------------------------MAX --4800 ------------60 60 ------------UNIT kHz kHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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TABLE 8.3: GENERAL PCM TIMING PARAMETERS SYMBOL 1/TMCK DESCRIPTION Master Clock Frequency MIN --TYP 256 512 1536 1544 2048 2560 4096 4800 ------------MAX --UNIT kHz
TMCKH / TMCK TMCKH TMCKL TFTRHM TFTRSM TRISE TFALL
MCLK Duty Cycle for 256kHz Operation Minimum Pulse Width HIGH for MCLK(512kHz or Higher) Minimum Pulse Width LOW for MCLK (512kHz or Higher) MCLK falling Edge to FST Rising Edge Hold Time FST Rising Edge to MCLK Falling edge Setup Time Rise Time for All Digital Signals Fall Time for All Digital Signals
45% 50 50 50 50 -----
55% --------50 50 ns ns ns ns ns ns
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9. ABSOLUTE MAXIMUM RATINGS
9.1. ABSOLUTE MAXIMUM RATINGS Condition
Junction temperature Storage temperature range Voltage applied to any pin Voltage applied to any pin (Input current limited to +/-20 mA) VDD - VSS 150 C -650C to +1500C (VSS - 0.3V) to (VDD + 0.3V) (VSS - 1.0V) to (VDD + 1.0V) -0.5V to +6V
0
Value
1. Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions.
9.2. OPERATING CONDITIONS
Condition Industrial operating temperature Supply voltage (VDD) Ground voltage (VSS)
Value -400C to +850C +2.7V to +5.25V 0V
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
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Publication Release Date: September 2005 Revision A.2
W681360
10. ELECTRICAL CHARACTERISTICS
10.1. GENERAL PARAMETERS
VDD=2.7V - 3.6V; VSS=0V; TA=-40C to +85C;
Symbol VIL VIH VOL VOH IDD ISB IPD IIL IOL CIN COUT
1. 2.
Parameters Input LOW Voltage Input HIGH Voltage PCMT Output LOW Voltage PCMT Output HIGH Voltage VDD Current (Operating) - ADC + DAC VDD Current (Standby) VDD Current (Power Down) Input Leakage Current PCMT Output Leakage Current Digital Input Capacitance PCMT Output Capacitance
Typical values: TA = 25C , VDD = 3.0 V
Conditions
Min (2)
Typ
(1)
Max
(2)
Units V V
0.6 2.2 IOL = 1.6 mA IOL = -1.6 mA No Load FST&FSR =Vss ; PUI=VDD (3) PUI= Vss
(3)
0.4 VDD-0.5 3.25 1 0.03 -10 -10 4.7 100 10 +10 +10 10
V V mA A A A A pF pF
VSSPCMT High Z
15
All min/max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. 3. No DC load from VREF & VAG to Vss
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Publication Release Date: September 2005 Revision A.2
W681360
10.2. ANALOG SIGNAL LEVEL AND GAIN PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40C to +85C; all analog signals referred to VAG; 0dBm0 = 0.436 Vrms = 5dBm @ 600 Ohm; FST =FSR = 8kHz;MCLK=BCLK= 2.048 MHz
PARAMETER Absolute Level Max. Transmit Level Absolute Gain (0 dBm0 @ 1020Hz; TA=+25C) Absolute Gain variation with Temperature Frequency Response, Relative to 0dBm0 @ 1020Hz (HB=0)
SYM. LABS TXMAX GABS GABST GRTV
CONDITION
TYP. 0.616 0.436 3.2 0.886 0 0 -------------------------
0 dBm0 = -5dBm @ 600
TRANSMIT (A/D) MIN. MAX. -------0.20 -0.05 -0.10 -------1.4 -0.2 -0.2 -0.2 -0.2 -0.7 --------+0.20 +0.05 +0.10 -45 -30 -26 -0.4 +0.2 +0.2 +0.2 +0.2 +0.15 0 -12.5 -32
RECEIVE (D/A) MIN. MAX. -------0.20 -0.05 -0.10 -0.5 -0.5 -0.5 -0.5 -0.2 -0.2 -0.25 -0.4 -0.8 --------+0.20 +0.05 +0.10 0 0 0 0 +0.2 +0.25 +0.2 +0.15 0 0 -12.5 -30
UNIT VPK VRMS dBm0 VPK dB dB
0 dBm0 @ 1020Hz; TA=+25C TA=0C to TA=+70C TA=-40C to TA=+85C 15Hz 50Hz 60Hz 200Hz 300 to 1600Hz 1600 to 2400Hz 2400 to 3000Hz 3300Hz 3400Hz 3600Hz 4000Hz 4600Hz to 100kHz
dB
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Publication Release Date: September 2005 Revision A.2
W681360
10.3. ANALOG DISTORTION AND NOISE PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40C to +85C; all analog signals referred to VAG; 0dBm0 = 0.436 Vrms = 5dBm @ 600 Ohm; FST =FSR = 8kHz;MCLK=BCLK= 2.048 MHz
PARAMETER Total Distortion vs. Level Tone (1020Hz, CMessage Weighted)
SYM. DLT
CONDITION +3 dBm0 0 dBm0 -10 dBm0 -20 dBm0 -30 dBm0 -40 dBm0 -50 dBm0 -60 dBm0 4600Hz to 7600Hz 7600Hz to 8400Hz 8400Hz to 100000Hz
Spurious Out-OfBand at RO(300Hz to 3400Hz @ 0dBm0) Crosstalk (1020Hz @ 0dBm0) Absolute Group Delay Group Delay Distortion (relative to group delay @ 1200Hz) Idle Channel Noise
DSPO
TRANSMIT (A/D) MIN. TYP. MAX. 55 --45 60 --50 60 --51 54 --50 44 --41 34 --32 24 --22 14 --12 ---------------------------------------75 360 750 380 130 130 750 18 -72
RECEIVE (D/A) MIN. TYP. MAX. 60 --50 63 --48 60 --45 55 --48 47 --45 37 --35 27 --25 17 --14 -----30 -----40 -----30 -------------------------------------75 240 750 370 120 120 750 12 -74
UNIT dBC
dB
DXT ABS D 1200Hz (HB=0) 500Hz 600Hz 1000Hz 2600Hz 2800Hz C-message weighted Psophometric weighted
dB sec sec
-----------------
NIDL
dBrnc0 dBm0p
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Publication Release Date: September 2005 Revision A.2
W681360
10.4. ANALOG INPUT AND OUTPUT AMPLIFIER PARAMETERS
VDD=2.7V to 3.6V; VSS=0V; TA=-40C to +85C; all analog signals referred to VAG;
PARAMETER AI Input Offset Voltage AI Input Current AI Input Resistance AI Input Capacitance AI Common Mode Input Voltage Range AI Common Mode Rejection Ratio AI Amp Gain Bandwidth Product AI Amp DC Open Loop Gain AI Amp Equivalent Input Noise AO Output Voltage Range Load Resistance Load Capacitance Load Capacitance AO & RO Output Current RO- Output Resistance RO- Output Offset Voltage Analog Ground Voltage VAG Output Resistance Power Supply Rejection Ratio (0 to 100kHz to VDD, C-message. All signals referenced to VAG) PAI Input Offset Voltage PAI Input Current PAI Input Resistance PAI Amp Gain Bandwidth Product Output Offset Voltage Load Capacitance
SYM. VOFF,AI IIN,AI RIN,AI CIN,AI VCM,AI CMRRTI GBWTI GTI NTI VTG RLDTGRO CLDTGAO CLDTGRO IOUT1 RROVOFF,ROVAG RVAG PSRR VOFF,PAI IIN,PAI RIN,PAI GBWPI VOFF,PO CLDPO
CONDITION AI+, AIAI+, AIAI+, AI- to VAG AI+, AIAI+, AIAI+, AIAO, RLD10k AO, RLD10k C-Message Weighted RLD=2k to VAG AO, RO to VAG AO RO 0.5 AO,RO- VDD-0.5 RO-, 0 to 3400Hz RO- to VAG Relative to VSS (no load) Within 25mV change Transmit Receive PAI PAI PAI to VAG PAO- no load (@10kHz) PAO+ to PAOPAO+, PAOdifferentially or PAO+, PAO to VAG
MIN. ----10 --1.2 --------0.4 2 ----1.0 ----VDD/2-0.1 --40 40 ----10 -------
TYP. --0.1 ------60 2500 95 -24 ----------1 --VDD/2 12.5 60 60 --0.05 --1000 -----
MAX. 25 1.0 --10 VDD-1.2 --------VDD-0.4 --100 200 ----25 VDD/2+0.1 25 ----25 1.0 ----50 1000
UNIT. mV A M pF V dB kHz dB dBrnC V k pF pF mA mV V dBC mV A M kHz mV pF
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Publication Release Date: September 2005 Revision A.2
W681360
VDD=2.7V to 3.6V; VSS=0V; TA=-40C to +85C; all analog signals referred to VAG;
PARAMETER PAO Output Current PAO Output Resistance PAO Differential Gain PAO Differential Signal to Distortion C-Message weighted
SYM. IOUTPAO RPAO GPAO DPAO
PAO Power Supply Rejection Ratio (0 to 25kHz to VDD, Differential out)
PSRRPA
O
CONDITION 0.4 PAO+,PAO-- VDD-0.4 PAO+ to PAORLD=300, +3dBm0, 1kHz, PAO+ to PAOZLD=300 ZLD=100nF + 20 ZLD=100 (10mA limit) 0 to 4kHz 4 to 25kHz
MIN. 10.0 ---0.2 45 ----40 ---
TYP. --1 0 60 40 40 55 40
MAX. ----+0.2 -----------
UNIT. mA dB dBC
dB
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Publication Release Date: September 2005 Revision A.2
W681360
10.5. DIGITAL I/O
10.5.1. PCM Codes for Zero and Full Scale Level + Full Scale + One Step Zero - One Step - Full Scale Sign bit 0 0 0 1 1 Magnitude Bits 1111 1111 1111 0000 0000 0001 0000 0000 0000 1111 1111 1111 0000 0000 0000
10.5.2. PCM Codes for 1kHz Digital Milliwatt Phase /8 3 / 8 5 / 8 7 / 8 9 / 8 11 / 8 13 / 8 15 / 8 Sign bit 0 0 0 0 1 1 1 1 Magnitude Bits 0100 0011 1100 1010 0011 1001 1010 0011 1001 0100 0011 1100 1011 1100 0100 0101 1100 0111 0101 1100 0111 1011 1100 0100
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Publication Release Date: September 2005 Revision A.2
W681360
11. TYPICAL APPLICATION CIRCUIT
VDD
1.5K 22 uF 62K + 1.0 uF 1.0 uF ELECTRET MICROPHONE 3.9K 3.9K 62K 27K 27K 100pF 100pF
1K
0.1 uF
U2 17 18 19 20 1 2 3 4 5 AO AIAI+ VAG VREF ROPAI PAO-
VDD
6
FST BCLKT PCMT MCLK PCMR BCLKR FSR
14 12 13 11 8 9 7
8 KHz Frame Sy nc 2.048 MHz Bit Clock PCM OUT PCM IN
0.01 uF 0.1 uF 27K
1.5K
VSS
PAO+ W681360
HB PUI
16 10
HP FILTER SELECT POWER CONTROL
SPEAKER
FIGURE 11.1: TYPICAL HANDSET INTERFACE
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Publication Release Date: September 2005 Revision A.2
15
W681360
12. PACKAGE DRAWING AND DIMENSIONS
12.1. 20L SOG (SOP)-300MIL
SMALL OUTLINE PACKAGE (SAME AS SOG & SOIC) DIMENSIONS
20
11
c
E
HE
L
1
D
10
0.2 O
A Y SEATING b e A GAUGE
SYMBOL A A1 b c E D e HE Y L 0
DIMENSION (MM) MAX. MIN. 2.35 0.10 2.65 0.30
DIMENSION (INCH) MIN. MAX. 0.104 0.012 0.013 0.020 0.009 0.013 0.291 0.299 0.496 0.512 0.050 BSC 0.394 0.419 0.004 0.016 0.050 0 8 0.093 0.004
0.33 0.51 0.23 0.32 7.40 7.60 12.60 13.00 1.27 BSC 10.00 10.65 0.10 0.40 1.27 0 8
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Publication Release Date: September 2005 Revision A.2
W681360
12.2. 20L SSOP-209 MIL
SHRINK SMALL OUTLINE PACKAGE DIMENSIONS
D 20 11
DTEAIL
HE E
1
10
A
SEATING PLANE
A L L
b
SEATING PLANE
Y
e
b
A
DETAIL
SYMBOL A A1 A2 b c D E HE e L L1 Y 0
DIMENSION (MM) NOM. MAX. MIN. 0.05 1.65 0.22 0.09 6.90 5.00 7.40 0.55 0 1.75 7.20 5.30 7.80 0.65 0.75 1.25 2.00 1.85 0.38 0.25 7.50 5.60 8.20 0.95 0.10 8
DIMENSION (INCH) MIN. NOM. MAX. 0.002 0.065 0.009 0.004 0.272 0.197 0.291 0.021 0 0.069 0.283 0.209 0.307 0.0256 0.030 0.050 0.079 0.015 0.010 0.295 0.220 0.323 0.037 0.004 8
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Publication Release Date: September 2005 Revision A.2
W681360
12.3. 20L TSSOP - 4.4X6.5MM
PLASTIC THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP) DIMENSIONS
SYMBOL A A1 A2 E HE D L L1 b e c 0 Y
MIN. 0.05 0.80 4.30 6.40 0.50 0.19 0.09 0
DIMENSION (MM) NOM. MAX. 1.20 0.15 0.90 1.05 4.40 4.50 6.40 BSC 6.50 6.60 0.60 0.75 1.00 REF 0.30 0.65 BSC 0.20 8 0.10 BASIC
DIMENSION (INCH) MIN. NOM. MAX. 0.047 0.002 0.006 0.031 0.035 0.041 0.169 0.173 0.177 .252 BSC 0.252 0.256 0.260 0.020 0.024 0.030 0.039 REF 0.007 0.012 0.026 BSC 0.004 0.008 0 8 0.004 BASIC
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Publication Release Date: September 2005 Revision A.2
W681360
12.3. QFN-32L
QUAD FLAT PACK NO LEADS PACKAGE (QFN) DIMENSIONS
L
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Publication Release Date: September 2005 Revision A.2
W681360
13. ORDERING INFORMATION
Winbond Part Number Description
W681360_ _
Product Family W681360 Package Material: Blank = Standard Package G = Pb-free (RoHS) Package
Package Type: S = 20-Lead Plastic Small Outline Package (SOG/SOP) R = 20-Lead Plastic Shrink Small Outline Package (SSOP) W = 20-Lead Plastic Thin Shrink Small Outline Package (TSSOP) Y = 32-Quad Flat No leads Package (QFN)
When ordering W681360 series devices, please refer to the following part numbers.
Part Number
W681360S W681360R W681360W W681360SG W681360RG W681360WG W681360YG*
* W681360YG available in Pb-free (RoHS) package only
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Publication Release Date: September 2005 Revision A.2
W681360
14. VERSION HISTORY
VERSION A.1 A.15 A.16 DATE April 2004 April 2005 September, 2005 PAGE All 32 2 6, 7 9 10, 12 22 27 31 32 DESCRIPTION Preliminary Specification Add Important Note Added reference to Pb-free RoHS packaging and to VRMS Added reference to QFN-32L package Added QFN-32L Pinout Added Pin numbers to Tables Capitalized logic HIGH/LOW Added Reference to VRMS Improved Application Diagram Added QFN-32L Mechanical Dimensions Added Y and G package ordering code
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Publication Release Date: September 2005 Revision A.2
W681360
Important Notice Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Winbond customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
The information contained in this datasheet may be subject to change without notice. It is the responsibility of the customer to check the Winbond USA website (www.winbond-usa.com) periodically for the latest version of this document, and any Errata Sheets that may be generated
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Publication Release Date: September 2005 Revision A.2


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